Fabrication of Pressure Conductive Silicone Rubber Socket Device by Shape-Controlled Nickel Powders Produced by High-Energy Ball Milling
Abstract
:1. Introduction
2. Experimental
2.1. Synthesis of the Flake Type Ni Powder
2.2. Socket Device Fabrication
2.3. Characterization
3. Results and Discussion
3.1. Mechanical Milling-Driven Microstructure Evolution of Ni Powder
3.2. Milling Mode and Deformation Mechanism of Ni Powder
3.3. Ni Powder-Based Pressure Conductive Silicone Rubber Socket Device
3.4. Magnetic Properties of the Ni Powder
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
- Kim, H.; Kim, J.J.; Park, J.; Park, S.; Choi, S.; Bae, B.; Ha, D.; Bae, M.; Kim, J. High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package. IEEE Trans. Compon. Packag. Manuf. Technol. 2017, 7, 1356–1368. [Google Scholar] [CrossRef]
- Fan, J.; Ye, X.; Kim, J.; Archambeault, B.; Orlandi, A. Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions. IEEE Trans. Electromagn. Compat. 2010, 52, 392–400. [Google Scholar] [CrossRef]
- Kim, H.; Bae, B.; Kim, J.J.; Park, J.; Ha, D.; Bae, M.; Kim, J. Modeling and analysis of a conductive rubber contactor for package test. In Proceedings of the 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Singapore, 2–4 December 2015; IEEE: Piscataway, NJ, USA, 2015; pp. 1–4. [Google Scholar]
- Sun, R.-B.; Wen, C.-Y.; Wu, R.-B. A New Isolation Structure of Pogo Pins for Crosstalk Reduction in a Test Socket. IEEE Trans. Compon. Packag. Manuf. Technol. 2011, 1, 586–594. [Google Scholar] [CrossRef]
- Ozbayat, S.; Sriboonlue, V.; Wang, T.; Luevano, G.R.; Shin, J.; Michalka, T. Measurement-and-Simulation-Based Determination of Electrical Properties of Au-Ni Composite Pins in Elastomeric Sockets. IEEE Lett. Electromagn. Compat. Pract. Appl. 2019, 1, 44–47. [Google Scholar] [CrossRef]
- Park, J.; Kim, H.; Kim, J.J.; Won, H.; Bae, B.; Kim, J.; Bae, M.; Ha, D. Modeling and measurement of high-bandwidth and high-density silicone rubber socket for 100Gbps transceiver IC test. In Proceedings of the 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 25–28 October 2015; IEEE: Piscataway, NJ, USA, 2015; pp. 109–112. [Google Scholar]
- Kim, H.; Park, J.; Park, S.; Kim, J.J.; Kim, J.; Ha, D.; Bae, M.; Shin, J. High-frequency modeling and signal integrity analysis of high-density silicone rubber socket. In Proceedings of the 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Honolulu, HI, USA, 14–16 December 2016; IEEE: Piscataway, NJ, USA, 2016; pp. 55–57. [Google Scholar]
- Yang, S.; Wu, J.; Tsai, D.; Pecht, M.G. Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket. IEEE Trans. Compon. Packag. Technol. 2007, 30, 81–85. [Google Scholar] [CrossRef]
- Liu, W.; Pecht, M.G.; Xie, J. Fundamental reliability issues associated with a commercial particle-in-elastomer interconnection system. IEEE Trans. Compon. Packag. Technol. 2001, 24, 520–525. [Google Scholar] [CrossRef]
- Park, J.; Kim, H.; Kim, J.J.; Bae, B.; Ha, D.; Bae, M.; Kim, J. Measurement of High-Bandwidth and High-Density Silicone Rubber Socket up to 110GHz. In Proceedings of the 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 31 May–3 June 2016; IEEE: Piscataway, NJ, USA, 2016; pp. 2481–2486. [Google Scholar]
- Szendrenyi, B.B.; Barnes, H.; Moreira, J.; Wollitzer, M.; Schmid, T.; Tsai, M. Addressing the Broadband Crosstalk Challenges of Pogo Pin Type Interfaces for High-Density High-Speed Digital Applications. In Proceedings of the 2007 IEEE/MTT-S International Microwave Symposium, Honolulu, HI, USA, 3–8 June 2007; IEEE: Piscataway, NJ, USA, 2007; pp. 2209–2212. [Google Scholar]
- Amin, N.; Yi, L.Z. A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test. In Proceedings of the 2008 IEEE International Conference on Semiconductor Electronics, Johar, Malaysia, 25–27 November 2008; IEEE: Piscataway, NJ, USA, 2008; pp. 393–397. [Google Scholar]
- Park, J.; Kim, H.; Kim, J.J.; Kim, D.-H.; Son, K.; Kim, S.; Lee, S.; Cho, K.; Bae, B.; Ha, D.; et al. High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test. IEEE Trans. Compon. Packag. Manuf. Technol. 2018, 8, 2152–2162. [Google Scholar] [CrossRef]
- Park, J.; Shin, T.; Kim, S.; Park, H.; Lho, D.; Cho, K.; Kim, H.; Kim, J.; Bae, M.; Ha, D. Electrical Performance Comparison between Coaxial and Non-coaxial Silicone Rubber Socket. In Proceedings of the 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan, 3–7 June 2019; IEEE: Piscataway, NJ, USA, 2019; pp. 293–296. [Google Scholar]
- Lopez, L.D.; Challa, V.; Pecht, M.G. Assessing the Reliability of Elastomer Sockets in Temperature Environments. IEEE Trans. Device Mater. Reliab. 2009, 9, 80–86. [Google Scholar] [CrossRef]
- Liu, W.; Lee, M.; Pecht, M.; Martens, R. An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses. IEEE Trans. Device Mater. Reliab. 2003, 3, 39–43. [Google Scholar] [CrossRef]
- Park, J.; Kim, H.; Kim, Y.; Kim, J.J.; Bae, B.; Kim, J.; Ha, D.; Bae, M. Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket. In Proceedings of the 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Seoul, South Korea, 14–16 December 2015; IEEE: Piscataway, NJ, USA, 2015; Volume 15, pp. 54–57. [Google Scholar]
- Zoz, H.; Ren, H.; Reichardt, R.; Benz, H.U. High Energy Milling/Mechanical Alloying/Reactive Milling; Zoz GmbH: Wenden, Germany, 1997; pp. 1–65. [Google Scholar]
- Rydin, R.W.; Maurice, D.; Courtney, T.H. Milling dynamics: Part I. Attritor dynamics: Results of a cinematographic study. Metall. Trans. A 1993, 24, 175–185. [Google Scholar] [CrossRef]
- Sadeghi, B.; Cavaliere, P. Progress of Flake Powder Metallurgy Research. Metals 2021, 11, 931. [Google Scholar] [CrossRef]
- Gheisari, K.H.; Javadpour, S.; Oh, J.T. The effect of milling speed on the magnetic properties of mechanically alloyed Fe-45%Ni powders. J. Phys. Conf. Ser. 2009, 153, 012051. [Google Scholar] [CrossRef]
- Dintwa, E.; Tijskens, E.; Ramon, H. On the accuracy of the Hertz model to describe the normal contact of soft elastic spheres. Granul. Matter 2008, 10, 209–221. [Google Scholar] [CrossRef]
- Aureli, M.; Doumanidis, C.C.; Gunduz, I.E.; Hussien, A.G.S.; Liao, Y.; Rebholz, C.; Doumanidis, C.C. Mechanics and energetics modeling of ball-milled metal foil and particle structures. Acta Mater. 2017, 123, 305–316. [Google Scholar] [CrossRef]
- Stoner, E.C.; Wohlfarth, E.P. A mechanism of magnetic hysteresis in heterogeneous alloys. IEEE Trans. Magn. 1991, 27, 3475–3518. [Google Scholar] [CrossRef]
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Reddyprakash, M.; Kim, D.; Choi, W.-J.; Yun, J.-H.; Loka, C.; Lee, K.-S. Fabrication of Pressure Conductive Silicone Rubber Socket Device by Shape-Controlled Nickel Powders Produced by High-Energy Ball Milling. Materials 2022, 15, 6670. https://doi.org/10.3390/ma15196670
Reddyprakash M, Kim D, Choi W-J, Yun J-H, Loka C, Lee K-S. Fabrication of Pressure Conductive Silicone Rubber Socket Device by Shape-Controlled Nickel Powders Produced by High-Energy Ball Milling. Materials. 2022; 15(19):6670. https://doi.org/10.3390/ma15196670
Chicago/Turabian StyleReddyprakash, Maddipatla, Daseul Kim, Woo-Jeong Choi, Ji-Hyeon Yun, Chadrasekhar Loka, and Kee-Sun Lee. 2022. "Fabrication of Pressure Conductive Silicone Rubber Socket Device by Shape-Controlled Nickel Powders Produced by High-Energy Ball Milling" Materials 15, no. 19: 6670. https://doi.org/10.3390/ma15196670
APA StyleReddyprakash, M., Kim, D., Choi, W.-J., Yun, J.-H., Loka, C., & Lee, K.-S. (2022). Fabrication of Pressure Conductive Silicone Rubber Socket Device by Shape-Controlled Nickel Powders Produced by High-Energy Ball Milling. Materials, 15(19), 6670. https://doi.org/10.3390/ma15196670