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Journal: MaterialsVolume: 15Number: 6640
Article: Thermal Conductivity Stability of Interfacial in Situ Al4C3 Engineered Diamond/Al Composites Subjected to Thermal Cycling
  • Authors:
  • Ning Li1,
  • Jinpeng Hao1 and
  • Yongjian Zhang1
  • et al.
Link: https://www.mdpi.com/1996-1944/15/19/6640

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