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Journal: Materials, 2022
Volume: 15
Number: 6640
6640
Article: Thermal Conductivity Stability of Interfacial in Situ Al₄C₃ Engineered Diamond/Al Composites Subjected to Thermal Cycling
Authors: by Ning Li, Jinpeng Hao, Yongjian Zhang, Wei Wang, Jie Zhao, Haijun Wu, Xitao Wang and Hailong Zhang
Link: https://www.mdpi.com/1996-1944/15/19/6640

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