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Journal: Materials, 2022
Volume: 15
Number: 5301
5301
Article: Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum
Authors: by Roman Kolenak, Igor Kostolny, Jaromir Drapala, Jan Urminsky, Alexej Pluhar, Paulina Babincova and Daniel Drimal
Link: https://www.mdpi.com/1996-1944/15/15/5301

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