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Journal: Materials, 2022
Volume: 15
Number: 4019

Article: Study on Simulation and Experiment of Cu, C-Doped Ag/Ni Contact Materials
Authors: by Ying Zhang, Jingqin Wang, Yancai Zhu, Defeng Cui and Ningyi Lu
Link: https://www.mdpi.com/1996-1944/15/11/4019

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