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Journal: Materials, 2022
Volume: 15
Number: 4019
Article:
Study on Simulation and Experiment of Cu, C-Doped Ag/Ni Contact Materials
Authors:
by
Ying Zhang, Jingqin Wang, Yancai Zhu, Defeng Cui and Ningyi Lu
Link:
https://www.mdpi.com/1996-1944/15/11/4019
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