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Journal: Materials, 2022
Volume: 15
Number: 3897
Article:
Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms
Authors:
by
Qing-Hua Su and Kuo-Ning Chiang
Link:
https://www.mdpi.com/1996-1944/15/11/3897
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