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Journal: Materials, 2021
Volume: 14
Number: 7039

Article: Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
Authors: by Jiri Hlina, Jan Reboun and Ales Hamacek
Link: https://www.mdpi.com/1996-1944/14/22/7039

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