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Journal: Materials, 2021
Volume: 14
Number: 238
238
Article: Generation of Self-Assembled 3D Network in TPU by Insertion of Al₂O₃/h-BN Hybrid for Thermal Conductivity Enhancement
Authors: by Kai-Han Su, Cherng-Yuh Su, Po-Wei Chi, Prem Chandan, Cheng-Ta Cho, Wan-Yu Chi and Maw-Kuen Wu
Link: https://www.mdpi.com/1996-1944/14/2/238

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