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Journal: Materials, 2021
Volume: 14
Number: 3485

Article: Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits
Authors: by Haotian Liu, Justin A. Weibel, Adrian S. Sabau, Patrick Geoghegan, Jian Chen and Eckhard A. Groll
Link: https://www.mdpi.com/1996-1944/14/13/3485

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