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        Journal: Materials, 2021
        Volume: 14 
                	Number: 3485 
                
        
        Article:
        Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits 
        Authors: 
       	by
                    Haotian Liu, Justin A. Weibel, Adrian S. Sabau, Patrick Geoghegan, Jian Chen and Eckhard A. Groll        
        Link:
        https://www.mdpi.com/1996-1944/14/13/3485
        
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