Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding
1
School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, China
2
Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China
3
School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China
*
Author to whom correspondence should be addressed.
Materials 2020, 13(8), 1918; https://doi.org/10.3390/ma13081918
Received: 27 March 2020
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Revised: 15 April 2020
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Accepted: 16 April 2020
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Published: 19 April 2020
(This article belongs to the Section Carbon Materials)
C/SiC composites are the preferred materials for hot-end structures and other important components of aerospace vehicles. It is important to reveal the material removal mechanism of ultrasound vibration-assisted grinding for realizing low damage and high efficiency processing of C/SiC composites. In this paper, a single abrasive particle ultrasound vibration cutting test was carried out. The failure modes of SiC matrix and carbon fiber under ordinary cutting and ultrasound cutting conditions were observed and analyzed. With the help of ultrasonic energy, compared with ordinary cutting, under the conditions of ultrasonic vibration-assisted grinding, the grinding force is reduced to varying degrees, and the maximum reduction ratio reaches about 60%, which means that ultrasonic vibration is beneficial to reduce the grinding force. With the observation of cutting debris, it is found that the size of debris is not much affected by the with ultrasound vibration. Thus, the ultrasound vibration-assisted grinding method is an effective method to achieve low damage and high efficiency processing of C/SiC composites.
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MDPI and ACS Style
Wang, D.; Lu, S.; Xu, D.; Zhang, Y. Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding. Materials 2020, 13, 1918. https://doi.org/10.3390/ma13081918
AMA Style
Wang D, Lu S, Xu D, Zhang Y. Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding. Materials. 2020; 13(8):1918. https://doi.org/10.3390/ma13081918
Chicago/Turabian StyleWang, Dongpo, Shouxiang Lu, Dong Xu, and Yuanlin Zhang. 2020. "Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding" Materials 13, no. 8: 1918. https://doi.org/10.3390/ma13081918
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