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Journal: Materials, 2020
Volume: 13
Number: 1710

Article: Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path
Authors: by Xudong Fang, Qiang Kang, Jianjun Ding, Lin Sun, Ryutaro Maeda and Zhuangde Jiang
Link: https://www.mdpi.com/1996-1944/13/7/1710

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