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Journal: Materials, 2020
Volume: 13
Number: 94
Article:
Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints
Authors:
by
Jiajie Fan, Jie Wu, Changzhen Jiang, Hao Zhang, Mesfin Ibrahim and Liang Deng
Link:
https://www.mdpi.com/1996-1944/13/1/94
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