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Journal: Materials, 2020
Volume: 13
Number: 94

Article: Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints
Authors: by Jiajie Fan, Jie Wu, Changzhen Jiang, Hao Zhang, Mesfin Ibrahim and Liang Deng
Link: https://www.mdpi.com/1996-1944/13/1/94

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