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Journal: Materials, 2020
Volume: 13
Number: 252
252
Article: IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints
Authors: by Ning Ren, Heng Fang, Dong Wang, Chenyi Hou, Yatao Zhao, Fan Chen, Ye Tian, Kyung-Wook Paik and Yiping Wu
Link: https://www.mdpi.com/1996-1944/13/1/252

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