Ren, N.; Fang, H.; Wang, D.; Hou, C.; Zhao, Y.; Chen, F.; Tian, Y.; Paik, K.-W.; Wu, Y.
IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints. Materials 2020, 13, 252.
https://doi.org/10.3390/ma13010252
AMA Style
Ren N, Fang H, Wang D, Hou C, Zhao Y, Chen F, Tian Y, Paik K-W, Wu Y.
IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints. Materials. 2020; 13(1):252.
https://doi.org/10.3390/ma13010252
Chicago/Turabian Style
Ren, Ning, Heng Fang, Dong Wang, Chenyi Hou, Yatao Zhao, Fan Chen, Ye Tian, Kyung-Wook Paik, and Yiping Wu.
2020. "IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints" Materials 13, no. 1: 252.
https://doi.org/10.3390/ma13010252
APA Style
Ren, N., Fang, H., Wang, D., Hou, C., Zhao, Y., Chen, F., Tian, Y., Paik, K.-W., & Wu, Y.
(2020). IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints. Materials, 13(1), 252.
https://doi.org/10.3390/ma13010252