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Journal: Materials, 2019
Volume: 12
Number: 3609
Article:
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
Authors:
by
Balázs Illés, Tamás Hurtony, Olivér Krammer, Bálint Medgyes, Karel Dušek and David Bušek
Link:
https://www.mdpi.com/1996-1944/12/21/3609
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