Illés, B.; Hurtony, T.; Krammer, O.; Medgyes, B.; Dušek, K.; Bušek, D.
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films. Materials 2019, 12, 3609.
https://doi.org/10.3390/ma12213609
AMA Style
Illés B, Hurtony T, Krammer O, Medgyes B, Dušek K, Bušek D.
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films. Materials. 2019; 12(21):3609.
https://doi.org/10.3390/ma12213609
Chicago/Turabian Style
Illés, Balázs, Tamás Hurtony, Olivér Krammer, Bálint Medgyes, Karel Dušek, and David Bušek.
2019. "Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films" Materials 12, no. 21: 3609.
https://doi.org/10.3390/ma12213609
APA Style
Illés, B., Hurtony, T., Krammer, O., Medgyes, B., Dušek, K., & Bušek, D.
(2019). Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films. Materials, 12(21), 3609.
https://doi.org/10.3390/ma12213609