Chen, H.; Du, J.; Liang, Y.; Wang, P.; Huang, J.; Zhang, J.; Zhao, Y.; Wang, X.; Zhang, X.; Wang, Y.;
et al. Comparison of Vacancy Sink Efficiency of Cu/V and Cu/Nb Interfaces by the Shared Cu Layer. Materials 2019, 12, 2628.
https://doi.org/10.3390/ma12162628
AMA Style
Chen H, Du J, Liang Y, Wang P, Huang J, Zhang J, Zhao Y, Wang X, Zhang X, Wang Y,
et al. Comparison of Vacancy Sink Efficiency of Cu/V and Cu/Nb Interfaces by the Shared Cu Layer. Materials. 2019; 12(16):2628.
https://doi.org/10.3390/ma12162628
Chicago/Turabian Style
Chen, Huaqiang, Jinlong Du, Yanxia Liang, Peipei Wang, Jinchi Huang, Jian Zhang, Yunbiao Zhao, Xingjun Wang, Xianfeng Zhang, Yuehui Wang,
and et al. 2019. "Comparison of Vacancy Sink Efficiency of Cu/V and Cu/Nb Interfaces by the Shared Cu Layer" Materials 12, no. 16: 2628.
https://doi.org/10.3390/ma12162628
APA Style
Chen, H., Du, J., Liang, Y., Wang, P., Huang, J., Zhang, J., Zhao, Y., Wang, X., Zhang, X., Wang, Y., Stanciu, G. A., & Fu, E.
(2019). Comparison of Vacancy Sink Efficiency of Cu/V and Cu/Nb Interfaces by the Shared Cu Layer. Materials, 12(16), 2628.
https://doi.org/10.3390/ma12162628