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Strong and Ductile Electroplated Heterogeneous Bulk Nanostructured Nickel

Institute of Materials, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China
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Materials 2019, 12(10), 1573; https://doi.org/10.3390/ma12101573
Received: 31 March 2019 / Revised: 6 May 2019 / Accepted: 9 May 2019 / Published: 14 May 2019
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Abstract

Porosity-free bulk nanostructured nickel cannot be fabricated by conventional electroplating due to hydrogen bubbling at the cathode. Here, we developed a cathode-rotating electroplating technique to remove the bubbles in order to obtain millimeter-scale nanostructured nickel rods with low porosity. The grain sizes ranged from 20 to 300 nm. The range produced by the new technique was broader than those that have been reported. The heterogeneous microstructure contributed to high work hardening rate, yield strength, and ductility of the rods in tension. The ductility was larger than electroplated thin nickel film with comparable ultimate strength in the literature. Dislocations accumulated at pre-existing twins, grain boundaries, and at the grain interior mediated the plastic deformation of the rods. View Full-Text
Keywords: nanostructured nickel; electroplating; heterogeneous microstructure; ductility; work hardening nanostructured nickel; electroplating; heterogeneous microstructure; ductility; work hardening
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Jiang, Y.; Yi, J.; Hu, K.; Zhao, J.; Huang, B.; Jia, Y.; Wang, G. Strong and Ductile Electroplated Heterogeneous Bulk Nanostructured Nickel. Materials 2019, 12, 1573.

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