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Materials 2018, 11(6), 979;

An Approach for Measuring the Dielectric Strength of OLED Materials

Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
Author to whom correspondence should be addressed.
Received: 7 May 2018 / Revised: 31 May 2018 / Accepted: 6 June 2018 / Published: 9 June 2018
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Surface roughness of electrodes plays a key role in the dielectric breakdown of thin-film organic devices. The rate of breakdown will increase when there are stochastic sharp spikes on the surface of electrodes. Additionally, surface having spiking morphology makes the determination of dielectric strength very challenging, specifically when the layer is relatively thin. We demonstrate here a new approach to investigate the dielectric strength of organic thin films for organic light-emitting diodes (OLEDs). The thin films were deposited on a substrate using physical vapor deposition (PVD) under high vacuum. The device architectures used were glass substrate/indium tin oxide (ITO)/organic material/aluminum (Al) and glass substrate/Al/organic material/Al. The dielectric strength of the OLED materials was evaluated from the measured breakdown voltage and layer thickness. View Full-Text
Keywords: Breakdown voltage; Dielectric strength; OLED Breakdown voltage; Dielectric strength; OLED

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Sudheendran Swayamprabha, S.; Kumar Dubey, D.; Song, W.-C.; Lin, Y.-T.; Ashok Kumar Yadav, R.; Singh, M.; Jou, J.-H. An Approach for Measuring the Dielectric Strength of OLED Materials. Materials 2018, 11, 979.

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