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Journal: Materials, 2018
Volume: 11
Number: 2022
Article:
Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping
Authors:
by
Yong Hu, Dong Shi, Ye Hu, Hongwei Zhao and Xingdong Sun
Link:
https://www.mdpi.com/1996-1944/11/10/2022
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