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Journal: Materials, 2018
Volume: 11
Number: 84

Article: Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging
Authors: by Yulong Li, Weifeng Long, Xiaowu Hu and Yanshu Fu
Link: https://www.mdpi.com/1996-1944/11/1/84

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