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Open AccessArticle

Electrodeposited Organic Layers Formed from Aryl Diazonium Salts for Inhibition of Copper Corrosion

National Institute of Research and Development for Biological Sciences, Centre of Bioanalysis, 296 Splaiul Independentei, 060031 Bucharest, Romania
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Academic Editor: Douglas Ivey
Materials 2017, 10(3), 235; https://doi.org/10.3390/ma10030235
Received: 16 January 2017 / Revised: 20 February 2017 / Accepted: 23 February 2017 / Published: 28 February 2017
(This article belongs to the Section Advanced Composites)
Copper substrates deposed on a gold screen-printed electrode were covered with different aryl diazonium salts by electrodeposition at 0.25 mA for 30 or 300 s. Seven compounds were investigated: 4-aminophenylacetic acid, 4-aminophenethyl alcohol, 4-fluoroaniline, 4-(heptadecafluorooctyl)aniline, 4-aminoantipyrine, 4-(4-aminophenyl)butyric acid and 3,4,5-trimethoxyaniline. Quantitative monitoring of the electrodeposition process was carried out by electrogravimetry using quartz crystal microbalance (QCM). The electrodeposited mass varies between 26 ng/cm2 for 4-fluoroaniline formed during 30 s to 442 ng/cm2 for 4-phenylbutyric acid formed during 300 s. The corrosion inhibition properties of aryl-modified layers have been studied in buffer citrate with pH = 3 or 3.5% NaCl solutions using electrochemical noise (ECN) and Tafel potentiodynamic polarization measurements. A corrosion inhibiting efficiency up to 90% was found. The highest corrosion inhibition was obtained for 4-(4-aminophenyl)butyric acid and the lowest for 4-fluoroaniline. A relation between the inhibition efficiency and the chemical nature of the substituents in the protective layer was found. View Full-Text
Keywords: copper; diazonium salts; quartz crystal microbalance; Tafel polarization; electrochemical noise copper; diazonium salts; quartz crystal microbalance; Tafel polarization; electrochemical noise
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MDPI and ACS Style

Chira, A.; Bucur, B.; Radu, G.-L. Electrodeposited Organic Layers Formed from Aryl Diazonium Salts for Inhibition of Copper Corrosion. Materials 2017, 10, 235.

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