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Article

Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

1
ROHM Co., Ltd., Kyoto 615-8585, Japan
2
Faculty of Engineering, Uzumasa, Kyoto University of Advanced Science, Kyoto 615-8577, Japan
*
Author to whom correspondence should be addressed.
Academic Editor: Alberto Castellazzi
Energies 2021, 14(17), 5532; https://doi.org/10.3390/en14175532
Received: 5 July 2021 / Revised: 30 August 2021 / Accepted: 2 September 2021 / Published: 4 September 2021
This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of thermal shock test (TST). Two different types of silver paste, nano-sized silver paste (NP) and nano-micron-sized paste (NMP), were used to sinter the silver film at 300 °C under a pressure of 60 MPa. The mean porosity (p) of the NP and MNP s-Ag films was 2.4% and 8%, respectively. The pore shape of the NP s-Ag was almost spherical, whereas the NMP s-Ag had an irregular shape resembling a peanut shell. After performing the TST at temperatures ranging from −40 to 150 °C, the scanning acoustic tomography (SAT) results suggested that delamination occurs from the edge of the assembly, and the delamination of the NMP s-Ag assembly was faster than that of the NM s-Ag assembly. The NMP s-Ag assembly showed a random delamination, indicating that the delamination speed varies from place to place. The difference in fracture mechanism is discussed based on cross-sectional scanning electron microscope (SEM) observation results after TST and plastic strain distribution results estimated by finite element analysis (FEA) considering pore configuration. View Full-Text
Keywords: sintered silver; porosity; thermal mechanical reliability design; fracture mechanism; low thermal impedance packaging sintered silver; porosity; thermal mechanical reliability design; fracture mechanism; low thermal impedance packaging
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MDPI and ACS Style

Wakamoto, K.; Otsuka, T.; Nakahara, K.; Namazu, T. Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test. Energies 2021, 14, 5532. https://doi.org/10.3390/en14175532

AMA Style

Wakamoto K, Otsuka T, Nakahara K, Namazu T. Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test. Energies. 2021; 14(17):5532. https://doi.org/10.3390/en14175532

Chicago/Turabian Style

Wakamoto, Keisuke, Takukazu Otsuka, Ken Nakahara, and Takahiro Namazu. 2021. "Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test" Energies 14, no. 17: 5532. https://doi.org/10.3390/en14175532

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