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Sensors 2009, 9(2), 1188-1203;

Flexible Electronics Sensors for Tactile Multi-Touching

Department of Engineering Science, National Cheng Kung University, Tainan 701, Taiwan
Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan
Institute of Mechanical and Electromechanical Engineering, National Formosa University, Yunlin 632, Taiwan
Author to whom correspondence should be addressed.
Received: 12 February 2009 / Revised: 20 February 2009 / Accepted: 23 February 2009 / Published: 24 February 2009
(This article belongs to the Section Chemical Sensors)
Full-Text   |   PDF [406 KB, uploaded 21 June 2014]


Flexible electronics sensors for tactile applications in multi-touch sensing and large scale manufacturing were designed and fabricated. The sensors are based on polyimide substrates, with thixotropy materials used to print organic resistances and a bump on the top polyimide layer. The gap between the bottom electrode layer and the resistance layer provides a buffer distance to reduce erroneous contact during large bending. Experimental results show that the top membrane with a bump protrusion and a resistance layer had a large deflection and a quick sensitive response. The bump and resistance layer provided a concentrated von Mises stress force and inertial force on the top membrane center. When the top membrane had no bump, it had a transient response delay time and took longer to reach steady-state. For printing thick structures of flexible electronics sensors, diffusion effects and dimensional shrinkages can be improved by using a paste material with a high viscosity. Linear algorithm matrixes with Gaussian elimination and control system scanning were used for multi-touch detection. Flexible electronics sensors were printed with a resistance thickness of about 32 µm and a bump thickness of about 0.2 mm. Feasibility studies show that printing technology is appropriate for large scale manufacturing, producing sensors at a low cost. View Full-Text
Keywords: Flexible electronics; tactile; bending; organic resistance; multi-touching; printing technology; large area Flexible electronics; tactile; bending; organic resistance; multi-touching; printing technology; large area
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Chang, W.-Y.; Fang, T.-H.; Yeh, S.-H.; Lin, Y.-C. Flexible Electronics Sensors for Tactile Multi-Touching. Sensors 2009, 9, 1188-1203.

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