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Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

Dipartimento di Ingegneria Strutturale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano (Italy)
MEMS Product Division, STMicroelectronics, Via Tolomeo 1, 20010 Cornaredo (Italy)
Author to whom correspondence should be addressed.
Sensors 2007, 7(9), 1817-1833;
Received: 30 August 2007 / Accepted: 6 September 2007 / Published: 7 September 2007
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
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The effect of accidental drops on MEMS sensors are examined within the frame-work of a multi-scale finite element approach. With specific reference to a polysilicon MEMSaccelerometer supported by a naked die, the analysis is decoupled into macro-scale (at dielength-scale) and meso-scale (at MEMS length-scale) simulations, accounting for the verysmall inertial contribution of the sensor to the overall dynamics of the device. Macro-scaleanalyses are adopted to get insights into the link between shock waves caused by the impactagainst a target surface and propagating inside the die, and the displacement/acceleration his-tories at the MEMS anchor points. Meso-scale analyses are adopted to detect the most stresseddetails of the sensor and to assess whether the impact can lead to possible localized failures.Numerical results show that the acceleration at sensor anchors cannot be considered an ob-jective indicator for drop severity. Instead, accurate analyses at sensor level are necessary toestablish how MEMS can fail because of drops. View Full-Text
Keywords: polysilicon MEMS; drop test; multi-scale finite element analysis. polysilicon MEMS; drop test; multi-scale finite element analysis.
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Mariani, S.; Ghisi, A.; Corigliano, A.; Zerbini, S. Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts. Sensors 2007, 7, 1817-1833.

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