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Journal: Sensors, 2024
Volume: 24
Number: 995

Article: Void-Engineered Metamaterial Delay Line with Built-In Impedance Matching for Ultrasonic Applications
Authors: by Rajendra P. Palanisamy, Luis A. Chavez, Raymond Castro and Alp T. Findikoglu
Link: https://www.mdpi.com/1424-8220/24/3/995

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