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Journal: Sensors, 2023
Volume: 23
Number: 2965
Article:
Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends
Authors:
by
Pin-Cheng Kuo, Chi-Wai Chow, Yuan-Zeng Lin, Wahyu Hendra Gunawan, Tun-Yao Hung, Yin-He Jian, Guan-Hong Chen, Ching-Wei Peng, Yang Liu and Chien-Hung Yeh
Link:
https://www.mdpi.com/1424-8220/23/6/2965
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