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Journal: Sensors, 2023
Volume: 23
Number: 8579
Article:
Skill-Learning Method of Dual Peg-in-Hole Compliance Assembly for Micro-Device
Authors:
by
Yuting Wu, Juan Zhang, Yi Yang, Wenrong Wu and Kai Du
Link:
https://www.mdpi.com/1424-8220/23/20/8579
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