Next Article in Journal
Induction Motor Stator Winding Inter-Tern Short Circuit Fault Detection Based on Start-Up Current Envelope Energy
Previous Article in Journal
Rapid Method of Wastewater Classification by Electronic Nose for Performance Evaluation of Bioreactors with Activated Sludge
Previous Article in Special Issue
Micro-Vision Based High-Precision Space Assembly Approach for Trans-Scale Micro-Device: The CFTA Example
 
 

Order Article Reprints

Journal: Sensors, 2023
Volume: 23
Number: 8579

Article: Skill-Learning Method of Dual Peg-in-Hole Compliance Assembly for Micro-Device
Authors: by Yuting Wu, Juan Zhang, Yi Yang, Wenrong Wu and Kai Du
Link: https://www.mdpi.com/1424-8220/23/20/8579

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop