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Journal: Sensors, 2023
Volume: 23
Number: 8565
8565
Article: Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies
Authors: by Tiago Maurício Leite, Cláudia Freitas, Roberto Magalhães, Alexandre Ferreira da Silva, José R. Alves, Júlio C. Viana and Isabel Delgado
Link: https://www.mdpi.com/1424-8220/23/20/8565

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