Leite, T.M.; Freitas, C.; Magalhães, R.; Ferreira da Silva, A.; Alves, J.R.; Viana, J.C.; Delgado, I.
Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies. Sensors 2023, 23, 8565.
https://doi.org/10.3390/s23208565
AMA Style
Leite TM, Freitas C, Magalhães R, Ferreira da Silva A, Alves JR, Viana JC, Delgado I.
Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies. Sensors. 2023; 23(20):8565.
https://doi.org/10.3390/s23208565
Chicago/Turabian Style
Leite, Tiago MaurÃcio, Cláudia Freitas, Roberto Magalhães, Alexandre Ferreira da Silva, José R. Alves, Júlio C. Viana, and Isabel Delgado.
2023. "Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies" Sensors 23, no. 20: 8565.
https://doi.org/10.3390/s23208565
APA Style
Leite, T. M., Freitas, C., Magalhães, R., Ferreira da Silva, A., Alves, J. R., Viana, J. C., & Delgado, I.
(2023). Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies. Sensors, 23(20), 8565.
https://doi.org/10.3390/s23208565
