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Journal: Sensors, 2023
Volume: 23
Number: 6350

Article: Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing
Authors: by Tae-Kyun Kim, Jong-Gwan Yook, Joo-Yong Kim, Yong-Ho Cho and Uh-Hyeon Lee
Link: https://www.mdpi.com/1424-8220/23/14/6350

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