Next Article in Journal
Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature
Previous Article in Journal
Software Architecture Patterns for Extending Sensing Capabilities and Data Formatting in Mobile Sensing
 
 
Article

Article Versions Notes

Sensors 2022, 22(7), 2812; https://doi.org/10.3390/s22072812
Action Date Notes Link
article html file updated 2 August 2022 17:32 CEST Update https://www.mdpi.com/1424-8220/22/7/2812/html
article html file updated 7 April 2022 05:26 CEST Update -
article pdf uploaded. 7 April 2022 05:25 CEST Updated version of record https://www.mdpi.com/1424-8220/22/7/2812/pdf
article xml uploaded. 7 April 2022 05:25 CEST Update https://www.mdpi.com/1424-8220/22/7/2812/xml
article xml file uploaded 7 April 2022 05:25 CEST Update -
article html file updated 6 April 2022 13:33 CEST Original file -
article pdf uploaded. 6 April 2022 13:31 CEST Version of Record https://www.mdpi.com/1424-8220/22/7/2812/pdf-vor
article xml uploaded. 6 April 2022 13:31 CEST Update -
article xml file uploaded 6 April 2022 13:31 CEST Original file -
Back to TopTop