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Journal: Sensors, 2021
Volume: 21
Number: 7332
7332
Article: UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper
Authors: by Mohammad Al Ktash, Mona Stefanakis, Tim Englert, Maryam S. L. Drechsel, Jan Stiedl, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner and Marc Brecht
Link: https://www.mdpi.com/1424-8220/21/21/7332

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