Al Ktash, M.; Stefanakis, M.; Englert, T.; Drechsel, M.S.L.; Stiedl, J.; Green, S.; Jacob, T.; Boldrini, B.; Ostertag, E.; Rebner, K.;
et al. UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper. Sensors 2021, 21, 7332.
https://doi.org/10.3390/s21217332
AMA Style
Al Ktash M, Stefanakis M, Englert T, Drechsel MSL, Stiedl J, Green S, Jacob T, Boldrini B, Ostertag E, Rebner K,
et al. UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper. Sensors. 2021; 21(21):7332.
https://doi.org/10.3390/s21217332
Chicago/Turabian Style
Al Ktash, Mohammad, Mona Stefanakis, Tim Englert, Maryam S. L. Drechsel, Jan Stiedl, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner,
and et al. 2021. "UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper" Sensors 21, no. 21: 7332.
https://doi.org/10.3390/s21217332
APA Style
Al Ktash, M., Stefanakis, M., Englert, T., Drechsel, M. S. L., Stiedl, J., Green, S., Jacob, T., Boldrini, B., Ostertag, E., Rebner, K., & Brecht, M.
(2021). UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper. Sensors, 21(21), 7332.
https://doi.org/10.3390/s21217332