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Article

Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits

Institute of Industrial Sciences and Technologies, University of Applied Sciences and Arts Western Switzerland (HEPIA/HES-SO Geneva), CH-1202 Geneva, Switzerland
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Academic Editors: Francisco Molina-Lopez and Almudena Rivadeneyra
Sensors 2021, 21(20), 6802; https://doi.org/10.3390/s21206802
Received: 1 September 2021 / Revised: 2 October 2021 / Accepted: 11 October 2021 / Published: 13 October 2021
(This article belongs to the Special Issue 2D/3D Printed Sensors and Electronics)
The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates even on flexible, curved or irregular surfaces. Silver-based inks were used for the formulation of conductive layers while UV inks were employed to fulfil the functionality of the insulating layers. To demonstrate the functionality of the pad-printing results, a multilayer test pattern has been designed and printed on Kapton®. Furthermore, to demonstrate the efficacy of this approach, a multilayer circuit composed of three stacked layers has been designed and printed on various substrates including Kapton®, paper and wood. This electronic circuit controls an array of LEDs through the manipulation of a two-key capacitive touch sensor. This study, allowed us to define recommendations for the different parameters leading to high printing quality. We expect a long-term beneficial impact of this study towards a low-cost, fast, and environmental-friendly production of printed electronics. View Full-Text
Keywords: pad-printing; conductive inks; insulating inks; UV curable inks; dielectric inks; multilayer printing; printed electronics; flexible electronics; additive manufacturing pad-printing; conductive inks; insulating inks; UV curable inks; dielectric inks; multilayer printing; printed electronics; flexible electronics; additive manufacturing
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MDPI and ACS Style

Jaafar, A.; Schoinas, S.; Passeraub, P. Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits. Sensors 2021, 21, 6802. https://doi.org/10.3390/s21206802

AMA Style

Jaafar A, Schoinas S, Passeraub P. Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits. Sensors. 2021; 21(20):6802. https://doi.org/10.3390/s21206802

Chicago/Turabian Style

Jaafar, Ahmad, Spyridon Schoinas, and Philippe Passeraub. 2021. "Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits" Sensors 21, no. 20: 6802. https://doi.org/10.3390/s21206802

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