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Journal: SensorsVolume: 19Number: 3979
Article: Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress
  • Authors:
  • Jun Eon An1,2,
  • Usung Park2 and
  • Dong Geon Jung1
  • et al.
Link: https://www.mdpi.com/1424-8220/19/18/3979

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