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Journal: Sensors, 2019
Volume: 19
Number: 3979

Article: Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress
Authors: by Jun Eon An, Usung Park, Dong Geon Jung, Chihyun Park and Seong Ho Kong
Link: https://www.mdpi.com/1424-8220/19/18/3979

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