Article Versions Notes

Zhang M, Yang J, He Y, Yang F, Yang F, Han G, Si C, Ning J. Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Sensors. 2019; 19(1):93. https://doi.org/10.3390/s19010093

Zhang, Meng, Jian Yang, Yurong He, Fan Yang, Fuhua Yang, Guowei Han, Chaowei Si, and Jin Ning. 2019. "Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via" Sensors 19, no. 1: 93. https://doi.org/10.3390/s19010093

Zhang, M., Yang, J., He, Y., Yang, F., Yang, F., Han, G., Si, C., & Ning, J. (2019). Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Sensors, 19(1), 93. https://doi.org/10.3390/s19010093