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Sensors 2018, 18(1), 299; https://doi.org/10.3390/s18010299

A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors

1
School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, North Jianshe Road, Chengdu 610054, China
2
State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, North Jianshe Road, Chengdu 610054, China
3
The 29th Research Institute of China Electronics Technology Group Corporation, 496 West Yingkang Road, Chengdu 610036, China
*
Author to whom correspondence should be addressed.
Received: 16 December 2017 / Revised: 11 January 2018 / Accepted: 16 January 2018 / Published: 19 January 2018
(This article belongs to the Special Issue Integrated Sensors)
Full-Text   |   PDF [15850 KB, uploaded 19 January 2018]   |  

Abstract

A micro-channel heat sink is a promising cooling method for high power integrated circuits (IC). However, the understanding of such a micro-channel device is not sufficient, because the tools for studying it are very limited. The details inside the micro-channels are not readily available. In this letter, a micro-channel heat sink is comprehensively studied using the integrated temperature sensors. The highly sensitive thin film temperature sensors can accurately monitor the temperature change in the micro-channel in real time. The outstanding heat dissipation performance of the micro-channel heat sink is proven in terms of maximum temperature, cooling speed and heat resistance. The temperature profile along the micro-channel is extracted, and even small temperature perturbations can be detected. The heat source formed temperature peak shifts towards the flow direction with the increasing flow rate. However, the temperature non-uniformity is independent of flow rate, but solely dependent on the heating power. Specific designs for minimizing the temperature non-uniformity are necessary. In addition, the experimental results from the integrated temperature sensors match the simulation results well. This can be used to directly verify the modeling results, helping to build a convincing simulation model. The integrated sensor could be a powerful tool for studying the micro-channel based heat sink. View Full-Text
Keywords: micro-channel heat sink; power IC; thin film temperature sensors; microfluidics; heat dissipation micro-channel heat sink; power IC; thin film temperature sensors; microfluidics; heat dissipation
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Wang, T.; Wang, J.; He, J.; Wu, C.; Luo, W.; Shuai, Y.; Zhang, W.; Chen, X.; Zhang, J.; Lin, J. A Comprehensive Study of a Micro-Channel Heat Sink Using Integrated Thin-Film Temperature Sensors. Sensors 2018, 18, 299.

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