Order Article Reprints

Li W, Liang T, Chen Y, Jia P, Xiong J, Hong Y, Lei C, Yao Z, Qi L, Liu W. Interface Characteristics of Sapphire Direct Bonding for High-Temperature Applications. Sensors. 2017; 17(9):2080. https://doi.org/10.3390/s17092080

Li, Wangwang, Ting Liang, Yulei Chen, Pinggang Jia, Jijun Xiong, Yingping Hong, Cheng Lei, Zong Yao, Lei Qi, and Wenyi Liu. 2017. "Interface Characteristics of Sapphire Direct Bonding for High-Temperature Applications" Sensors 17, no. 9: 2080. https://doi.org/10.3390/s17092080

Li, W., Liang, T., Chen, Y., Jia, P., Xiong, J., Hong, Y., Lei, C., Yao, Z., Qi, L., & Liu, W. (2017). Interface Characteristics of Sapphire Direct Bonding for High-Temperature Applications. Sensors, 17(9), 2080. https://doi.org/10.3390/s17092080