Zhang, Z.; Tian, B.; Yu, Q.; Shi, P.; Lin, Q.; Zhao, N.; Jing, W.; Jiang, Z.
Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates. Sensors 2017, 17, 857.
https://doi.org/10.3390/s17040857
AMA Style
Zhang Z, Tian B, Yu Q, Shi P, Lin Q, Zhao N, Jing W, Jiang Z.
Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates. Sensors. 2017; 17(4):857.
https://doi.org/10.3390/s17040857
Chicago/Turabian Style
Zhang, Zhongkai, Bian Tian, Qiuyue Yu, Peng Shi, Qijing Lin, Na Zhao, Weixuan Jing, and Zhuangde Jiang.
2017. "Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates" Sensors 17, no. 4: 857.
https://doi.org/10.3390/s17040857
APA Style
Zhang, Z., Tian, B., Yu, Q., Shi, P., Lin, Q., Zhao, N., Jing, W., & Jiang, Z.
(2017). Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates. Sensors, 17(4), 857.
https://doi.org/10.3390/s17040857