Order Article Reprints

Bae JY, Lee K-S, Hur H, Nam K-H, Hong S-J, Lee A-Y, Chang KS, Kim G-H, Kim G. 3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach. Sensors. 2017; 17(10):2331. https://doi.org/10.3390/s17102331

Bae, Ji Yong, Kye-Sung Lee, Hwan Hur, Ki-Hwan Nam, Suk-Ju Hong, Ah-Yeong Lee, Ki Soo Chang, Geon-Hee Kim, and Ghiseok Kim. 2017. "3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach" Sensors 17, no. 10: 2331. https://doi.org/10.3390/s17102331

Bae, J. Y., Lee, K.-S., Hur, H., Nam, K.-H., Hong, S.-J., Lee, A.-Y., Chang, K. S., Kim, G.-H., & Kim, G. (2017). 3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach. Sensors, 17(10), 2331. https://doi.org/10.3390/s17102331