Matteucci, M.; Heiskanen, A.; Zór, K.; Emnéus, J.; Taboryski, R.
Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry. Sensors 2016, 16, 1795.
https://doi.org/10.3390/s16111795
AMA Style
Matteucci M, Heiskanen A, Zór K, Emnéus J, Taboryski R.
Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry. Sensors. 2016; 16(11):1795.
https://doi.org/10.3390/s16111795
Chicago/Turabian Style
Matteucci, Marco, Arto Heiskanen, Kinga Zór, Jenny Emnéus, and Rafael Taboryski.
2016. "Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry" Sensors 16, no. 11: 1795.
https://doi.org/10.3390/s16111795
APA Style
Matteucci, M., Heiskanen, A., Zór, K., Emnéus, J., & Taboryski, R.
(2016). Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry. Sensors, 16(11), 1795.
https://doi.org/10.3390/s16111795