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Journal: Sensors, 2014
Volume: 14
Number: 24244

Article: A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging
Authors: by Zhenyu Luo, Deyong Chen, Junbo Wang, Yinan Li and Jian Chen
Link: https://www.mdpi.com/1424-8220/14/12/24244

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