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Journal: Int. J. Mol. Sci., 2022
Volume: 23
Number: 1891

Article: Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects
Authors: by Rúben F. Santos, Bruno M. C. Oliveira, Liliane C. G. Savaris, Paulo J. Ferreira and Manuel F. Vieira
Link: https://www.mdpi.com/1422-0067/23/3/1891

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