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Journal: Molecules, 2024
Volume: 29
Number: 2230
Article:
Molecular Dynamics Simulation on Solidification Microstructure and Tensile Properties of Cu/SiC Composites
Authors:
by
Wanjun Yan, Yuhang Lu, Tinghong Gao, Junjie Wang, Xin Tang and Nan Wang
Link:
https://www.mdpi.com/1420-3049/29/10/2230
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