Next Article in Journal
Mechanical Fault Diagnosis of High Voltage Circuit Breakers Utilizing EWT-Improved Time Frequency Entropy and Optimal GRNN Classifier
Previous Article in Journal
Optimal Flow Distribution of Military Supply Transportation Based on Network Analysis and Entropy Measurement
Open AccessArticle

Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis

1
School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China
2
Beijing Xinghang Mechanical-Electrical Equipment Co., Beijing 10091, China
*
Author to whom correspondence should be addressed.
Entropy 2018, 20(6), 447; https://doi.org/10.3390/e20060447
Received: 17 April 2018 / Revised: 1 June 2018 / Accepted: 4 June 2018 / Published: 7 June 2018
During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product. View Full-Text
Keywords: assembly process; screening evaluation; defect stream; stress-strength model; entropy assembly process; screening evaluation; defect stream; stress-strength model; entropy
Show Figures

Figure 1

MDPI and ACS Style

Huang, Y.; Dai, W.; Liu, L.; Zhao, Y. Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis. Entropy 2018, 20, 447.

Show more citation formats Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop