Search Results (3)

The emergence of GaN-based micro-LEDs has revolutionized display technologies due to their superior brightness, energy efficiency, and thermal stability compared to traditional counterparts. However, the development of red-emitting micro-LEDs on silicon substrates (GaN-on-Si) faces significant challenges, among them including hydrogen-induced deactivation of p-GaN caused by hydrogen species generated from SiH₄ decomposition during SiO₂ passivation layer growth, which degrades device performance. This study systematically investigates the use of high-density metal-oxide dielectric passivation layers deposited by atomic layer deposition (ALD), specifically Al₂O₃ and HfO₂, to mitigate these effects and enhance device reliability. The passivation layers effectively suppress hydrogen diffusion and preserve p-GaN activation, ensuring improved ohmic contact formation and reduced forward voltage, which is measured by the probe station. The properties of the epitaxial layer and the cross-section morphology of the dielectric layer were characterized by photoluminescence (PL) and scanning electron microscopy (SEM), respectively. Experimental results reveal that Al₂O₃ exhibits superior thermal stability and lower current leakage under high-temperature annealing, while HfO₂ achieves higher light-output power (LOP) and efficiency under increased current densities. Electroluminescence (EL) measurements confirm that the passivation strategy maintains the intrinsic optical properties of the epitaxial wafer with minimal impact on Wp and FWHM across varying process conditions. The findings demonstrate the efficacy of metal-oxide dielectric passivation in addressing critical challenges in InGaN red micro-LED on silicon substrate fabrication, contributing to accelerating scalable and efficient next-generation display technologies. Full article

In order to develop a high-resolution piezoelectric walking actuator with a long stroke for the wafer probe station, this work presents a design of a piezoelectric walking actuator with two auxiliary clamping feet elastically attached to major clamping feet. Its construction was introduced and its operating principle was analyzed. Structure design details were discussed and a prototype was proposed. The prototype was fabricated and tested. The experimental results show that the proposed actuator can operate stably along a 20 mm guider. The proposed design is suitable for precision motion control applications. Full article

Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved. Full article