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Keywords = thin-disk bonding

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17 pages, 10333 KB  
Article
Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components Due to the Reflow Soldering Process
by Napatsorn Kimaporn, Chawit Samakkarn and Jatuporn Thongsri
Processes 2024, 12(9), 2029; https://doi.org/10.3390/pr12092029 - 20 Sep 2024
Cited by 1 | Viewed by 1218
Abstract
In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat generated by the welding tip to melt a solder ball for bonding the following essential HDD components: a flexible printed circuit (FPC) and a printed circuit cable (PCC). Since the [...] Read more.
In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat generated by the welding tip to melt a solder ball for bonding the following essential HDD components: a flexible printed circuit (FPC) and a printed circuit cable (PCC). Since the mentioned components are tiny and comprise many thin material layers, an experiment to study thermal and mechanical responses is complex and not worth it. Therefore, a static state multiphysics consisting of thermal analysis (TA) and structural analysis (SA) was employed to investigate both responses. First, the experiment was established to mimic the RSP, measuring the temperature generated by the actual welding tip. Then, the measured temperature was defined as the boundary conditions with the pressing force (F) for the TA and SA based on the actual operating conditions. As expected, the TA results revealed the temperature distribution in the HDD components, which was consistent with the theory and results from previous work and confirmed this work’s credibility. Significantly, the SA reported severe total deformation (δ) in FPC’s top and bottom ends. The maximum δ was 0.72–0.88 mm for the F of 0–1 N. The stronger the F, the greater the δ. This research highlights that multiphysics can investigate both responses in HDD components as slight as 0.1–100 microns thick, which can be used to develop a high-efficacy RSP. Full article
(This article belongs to the Special Issue Thermal Analysis, Modeling and Simulation in Engineering Processes)
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16 pages, 5341 KB  
Article
Composition-Tunable Properties of Cu(Ag) Alloy for Hybrid Bonding Applications
by Sarabjot Singh and Kathleen Dunn
Materials 2023, 16(23), 7481; https://doi.org/10.3390/ma16237481 - 2 Dec 2023
Cited by 2 | Viewed by 3757
Abstract
In the present study, the properties of Cu(Ag) alloy films were studied to evaluate their potential use as an alternate material for interconnection in hybrid bonding. Thin alloy films of Cu(Ag) were deposited by pulsed electrochemical deposition (PED) using a sulfuric acid-based bath, [...] Read more.
In the present study, the properties of Cu(Ag) alloy films were studied to evaluate their potential use as an alternate material for interconnection in hybrid bonding. Thin alloy films of Cu(Ag) were deposited by pulsed electrochemical deposition (PED) using a sulfuric acid-based bath, rotating disk electrode, and hot entry. Secondary ion mass spectrometry (SIMS) was used to measure the silver content of the films, with us finding that it decreases with increasing duty cycle. Thereafter, bright field scanning transmission electron microscope (STEM) imaging in combination with energy-dispersive x-ray spectroscopy (EDS) was used to visualize the thin film microstructure and to confirm the uniform distribution of silver throughout the film, with no bands being seen despite the pulsed nature of the deposition. Film resistance was measured by a four-point probe to quantify the impact of Ag content on resistivity, with us finding the expected linear relationship with the Ag content in the film. Furthermore, the coefficient of thermal expansion (CTE) of the films was measured using X-ray diffraction, and modulus and hardness were measured via nanoindentation, revealing linear dependences on the Ag content as well. Notably, the addition of 1.25 atom% Ag resulted in a significant increase in the CTE from 17.9 to 19.3 ppm/K, Young’s modulus from 111 to 161 GPa, and film hardness from 1.70 to 3.99 GPa. These simple relationships offer a range of properties tunable via the duty cycle of the pulsed plating, making Cu(Ag) a promising candidate for engineering wafer-to-wafer metal interconnections. Full article
(This article belongs to the Special Issue Electronic Packaging Materials and Technology Applications)
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27 pages, 2036 KB  
Review
Fabric Phase Sorptive Extraction: A Paradigm Shift Approach in Analytical and Bioanalytical Sample Preparation
by Abuzar Kabir and Victoria Samanidou
Molecules 2021, 26(4), 865; https://doi.org/10.3390/molecules26040865 - 6 Feb 2021
Cited by 83 | Viewed by 6434
Abstract
Fabric phase sorptive extraction (FPSE) is an evolutionary sample preparation approach which was introduced in 2014, meeting all green analytical chemistry (GAC) requirements by implementing a natural or synthetic permeable and flexible fabric substrate to host a chemically coated sol–gel organic–inorganic hybrid sorbent [...] Read more.
Fabric phase sorptive extraction (FPSE) is an evolutionary sample preparation approach which was introduced in 2014, meeting all green analytical chemistry (GAC) requirements by implementing a natural or synthetic permeable and flexible fabric substrate to host a chemically coated sol–gel organic–inorganic hybrid sorbent in the form of an ultra-thin coating. This construction results in a versatile, fast, and sensitive micro-extraction device. The user-friendly FPSE membrane allows direct extraction of analytes with no sample modification, thus eliminating/minimizing the sample pre-treatment steps, which are not only time consuming, but are also considered the primary source of major analyte loss. Sol–gel sorbent-coated FPSE membranes possess high chemical, solvent, and thermal stability due to the strong covalent bonding between the fabric substrate and the sol–gel sorbent coating. Subsequent to the extraction on FPSE membrane, a wide range of organic solvents can be used in a small volume to exhaustively back-extract the analytes after FPSE process, leading to a high preconcentration factor. In most cases, no solvent evaporation and sample reconstitution are necessary. In addition to the extensive simplification of the sample preparation workflow, FPSE has also innovatively combined the extraction principle of two major, yet competing sample preparation techniques: solid phase extraction (SPE) with its characteristic exhaustive extraction, and solid phase microextraction (SPME) with its characteristic equilibrium driven extraction mechanism. Furthermore, FPSE has offered the most comprehensive cache of sorbent chemistry by successfully combining almost all of the sorbents traditionally used exclusively in either SPE or in SPME. FPSE is the first sample preparation technique to exploit the substrate surface chemistry that complements the overall selectivity and the extraction efficiency of the device. As such, FPSE indeed represents a paradigm shift approach in analytical/bioanalytical sample preparation. Furthermore, an FPSE membrane can be used as an SPME fiber or as an SPE disk for sample preparation, owing to its special geometric advantage. So far, FPSE has overwhelmingly attracted the interest of the separation scientist community, and many analytical scientists have been developing new methodologies by implementing this cutting-edge technique for the extraction and determination of many analytes at their trace and ultra-trace level concentrations in environmental samples as well as in food, pharmaceutical, and biological samples. FPSE offers a total sample preparation solution by providing neutral, cation exchanger, anion exchanger, mixed mode cation exchanger, mixed mode anion exchanger, zwitterionic, and mixed mode zwitterionic sorbents to deal with any analyte regardless of its polarity, ionic state, or the sample matrix where it resides. Herein we present the theoretical background, synthesis, mechanisms of extraction and desorption, the types of sorbents, and the main applications of FPSE so far according to different sample categories, and to briefly show the progress, advantages, and the main principles of the proposed technique. Full article
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12 pages, 3780 KB  
Article
Investigation of the Tribofilm Formation of HiPIMS Sputtered MoSx Thin Films in Different Environments by Raman Scattering
by Wolfgang Tillmann, Alexandra Wittig, Dominic Stangier, Carl-Arne Thomann, Henning Moldenhauer, Jörg Debus, Daniel Aurich and Andreas Brümmer
Lubricants 2019, 7(11), 100; https://doi.org/10.3390/lubricants7110100 - 8 Nov 2019
Cited by 13 | Viewed by 3990
Abstract
Understanding the generation of third body particles and their contribution to the formation of tribofilms of MoSx thin films is still challenging due to a large number of influencing factors. Besides the structure of the as-deposited MoSx films, the environment and [...] Read more.
Understanding the generation of third body particles and their contribution to the formation of tribofilms of MoSx thin films is still challenging due to a large number of influencing factors. Besides the structure of the as-deposited MoSx films, the environment and the conditions during the Ball-on-disk tests affect tribofilms and thus the friction. Therefore, the influence of the surface pressure and sliding velocity in air, argon and nitrogen environments on the generation of the third body particles and the tribofilm formation of randomly oriented MoSx films is investigated. A high surface pressure is one major factor to achieve low friction, especially under humid conditions, which is important considering the use in industrial applications, for example dry-running screw machines. However, the mechanisms leading to that frictional behavior are still affected by the surrounding environment. While low friction is caused by a more extensive tribofilm formation in air, in argon and nitrogen, large size third body particles dispensed all over the contact area contribute to a lower friction. Raman scattering reveal a different chemistry of these particles reflected in the absence of laser- or temperature-induced surface oxidation compared to the as-deposited film and the wear track. The Raman scattering results are discussed with respect to the wear particle size, its chemical reactivity and strain-induced bonding changes. Full article
(This article belongs to the Special Issue Selected Papers from the 60th German Tribology Conference 2019)
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12 pages, 2194 KB  
Perspective
Advances in High-Power, Ultrashort Pulse DPSSL Technologies at HiLASE
by Martin Smrž, Ondřej Novák, Jiří Mužík, Hana Turčičová, Michal Chyla, Siva Sankar Nagisetty, Michal Vyvlečka, Lukáš Roškot, Taisuke Miura, Jitka Černohorská, Pawel Sikocinski, Liyuan Chen, Jaroslav Huynh, Patricie Severová, Alina Pranovich, Akira Endo and Tomáš Mocek
Appl. Sci. 2017, 7(10), 1016; https://doi.org/10.3390/app7101016 - 1 Oct 2017
Cited by 59 | Viewed by 7404
Abstract
The development of kW-class diode-pumped picosecond laser sources emitting at various wavelengths started at the HiLASE Center four years ago. A 500-W Perla C thin-disk laser with a diffraction limited beam and repetition rate of 50–100 kHz, a frequency conversion to mid-infrared (mid-IR), [...] Read more.
The development of kW-class diode-pumped picosecond laser sources emitting at various wavelengths started at the HiLASE Center four years ago. A 500-W Perla C thin-disk laser with a diffraction limited beam and repetition rate of 50–100 kHz, a frequency conversion to mid-infrared (mid-IR), and second to fifth harmonic frequencies was demonstrated. We present an updated review on the progress in the development of compact picosecond and femtosecond high average power radiation sources covering the ultraviolet (UV) to mid-IR spectral range at the HiLASE Center. We also report on thin-disk manufacturing by atomic diffusion bonding, which is a crucial technology for future high-power laser development. Full article
(This article belongs to the Section Optics and Lasers)
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23 pages, 3334 KB  
Article
Optimization of Sensing and Feedback Control for Vibration/Flutter of Rotating Disk by PZT Actuators via Air Coupled Pressure
by Tianhong Yan, Xinsheng Xu, Jianqiang Han, Rongming Lin, Bingfeng Ju and Qing Li
Sensors 2011, 11(3), 3094-3116; https://doi.org/10.3390/s110303094 - 10 Mar 2011
Cited by 6 | Viewed by 9139
Abstract
In this paper, a feedback control mechanism and its optimization for rotating disk vibration/flutter via changes of air-coupled pressure generated using piezoelectric patch actuators are studied. A thin disk rotates in an enclosure, which is equipped with a feedback control loop consisting of [...] Read more.
In this paper, a feedback control mechanism and its optimization for rotating disk vibration/flutter via changes of air-coupled pressure generated using piezoelectric patch actuators are studied. A thin disk rotates in an enclosure, which is equipped with a feedback control loop consisting of a micro-sensor, a signal processor, a power amplifier, and several piezoelectric (PZT) actuator patches distributed on the cover of the enclosure. The actuator patches are mounted on the inner or the outer surfaces of the enclosure to produce necessary control force required through the airflow around the disk. The control mechanism for rotating disk flutter using enclosure surfaces bonded with sensors and piezoelectric actuators is thoroughly studied through analytical simulations. The sensor output is used to determine the amount of input to the actuator for controlling the response of the disk in a closed loop configuration. The dynamic stability of the disk-enclosure system, together with the feedback control loop, is analyzed as a complex eigenvalue problem, which is solved using Galerkin’s discretization procedure. The results show that the disk flutter can be reduced effectively with proper configurations of the control gain and the phase shift through the actuations of PZT patches. The effectiveness of different feedback control methods in altering system characteristics and system response has been investigated. The control capability, in terms of control gain, phase shift, and especially the physical configuration of actuator patches, are also evaluated by calculating the complex eigenvalues and the maximum displacement produced by the actuators. To achieve a optimal control performance, sizes, positions and shapes of PZT patches used need to be optimized and such optimization has been achieved through numerical simulations. Full article
(This article belongs to the Section Physical Sensors)
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