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Keywords = silicone made build platform

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27 pages, 4822 KiB  
Review
Integrated Photonic Passive Building Blocks on Silicon-on-Insulator Platform
by Francesco Amanti, Greta Andrini, Fabrizio Armani, Fabrizio Barbato, Vittorio Bellani, Vincenzo Bonaiuto, Simone Cammarata, Matteo Campostrini, Thu Ha Dao, Fabio De Matteis, Valeria Demontis, Simone Donati, Giovanni Di Giuseppe, Sviatoslav Ditalia Tchernij, Andrea Fontana, Jacopo Forneris, Luca Frontini, Roberto Gunnella, Simone Iadanza, Ali Emre Kaplan, Cosimo Lacava, Valentino Liberali, Leonardo Martini, Francesco Marzioni, Luca Morescalchi, Elena Pedreschi, Paolo Piergentili, Domenic Prete, Valentino Rigato, Carlo Roncolato, Francesco Rossella, Matteo Salvato, Fausto Sargeni, Jafar Shojaii, Franco Spinella, Alberto Stabile, Alessandra Toncelli and Valerio Vitaliadd Show full author list remove Hide full author list
Photonics 2024, 11(6), 494; https://doi.org/10.3390/photonics11060494 - 23 May 2024
Cited by 6 | Viewed by 6447
Abstract
Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Although quite complex circuits can be made with such technology, everything is based [...] Read more.
Integrated photonics on Silicon-On-Insulator (SOI) substrates is a well developed research field that has already significantly impacted various fields, such as quantum computing, micro sensing devices, biosensing, and high-rate communications. Although quite complex circuits can be made with such technology, everything is based on a few ’building blocks’ which are then combined to form more complex circuits. This review article provides a detailed examination of the state of the art of integrated photonic building blocks focusing on passive elements, covering fundamental principles and design methodologies. Key components discussed include waveguides, fiber-to-chip couplers, edges and gratings, phase shifters, splitters and switches (including y-branch, MMI, and directional couplers), as well as subwavelength grating structures and ring resonators. Additionally, this review addresses challenges and future prospects in advancing integrated photonic circuits on SOI platforms, focusing on scalability, power efficiency, and fabrication issues. The objective of this review is to equip researchers and engineers in the field with a comprehensive understanding of the current landscape and future trajectories of integrated photonic components on SOI substrates with a 220 nm thick device layer of intrinsic silicon. Full article
(This article belongs to the Special Issue Photonic Integrated Circuits for Information, Computing and Sensing)
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26 pages, 4612 KiB  
Review
Review and New Aspects in Combining Multipoint Moulding and Additive Manufacturing
by Thomas Herzog and Carsten Tille
Appl. Sci. 2021, 11(3), 1201; https://doi.org/10.3390/app11031201 - 28 Jan 2021
Cited by 6 | Viewed by 2959
Abstract
Additive manufacturing has become a very important manufacturing method in the last years. With additive manufacturing, a higher level of function integration can be achieved compared to traditional manufacturing technologies. However, the manufacturing of larger parts leads to long construction times. A possible [...] Read more.
Additive manufacturing has become a very important manufacturing method in the last years. With additive manufacturing, a higher level of function integration can be achieved compared to traditional manufacturing technologies. However, the manufacturing of larger parts leads to long construction times. A possible solution is the combination of multipoint moulding with additive manufactured form elements. This article reviews the state of technology for multipoint moulding and additive manufacturing. Moreover, the state of technology is analysed to outline the possibilities and challenges of combining both technologies. The review shows that there has been research on different challenges of the new production process. On the other hand, it turns out clearly that there are many open points at the intersections of both technologies. Finally, the areas where further research is necessary are described in detail. Full article
(This article belongs to the Special Issue Additive Manufacturing and System: From Methods to Applications)
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