Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 

Saved Queries

Sign in to use this feature.

Search Filter Reset All

Years

Between: -

Subjects

remove_circle_outline
remove_circle_outline
remove_circle_outline
Add Subjects Reset
Select Subjects

Journals

remove_circle_outline
remove_circle_outline
Add Journals Reset
Select Journals

Article Types

remove_circle_outline
remove_circle_outline
Add Article Types Reset
Select Article Types

Countries / Regions

remove_circle_outline
Add Countries / Regions Reset
Select Countries / Regions
Update Search
share announcement

Search Results (2)

Search Parameters:
Keywords = polysilicon tensile strength

Order results
Result details
Results per page
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
14 pages, 2851 KiB  
Article
MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength
by Tiago Vicentini Ferreira do Valle, Stefano Mariani, Aldo Ghisi, Biagio De Masi, Francesco Rizzini, Gabriele Gattere and Carlo Valzasina
Micromachines 2023, 14(2), 443; https://doi.org/10.3390/mi14020443 - 13 Feb 2023
Cited by 3 | Viewed by 1746
Abstract
Polycrystalline silicon is a brittle material, and its strength results are stochastically linked to microscale (or even nanoscale) defects, possibly dependent on the grain size and morphology. In this paper, we focus on the out-of-plane tensile strength of columnar polysilicon. The investigation has [...] Read more.
Polycrystalline silicon is a brittle material, and its strength results are stochastically linked to microscale (or even nanoscale) defects, possibly dependent on the grain size and morphology. In this paper, we focus on the out-of-plane tensile strength of columnar polysilicon. The investigation has been carried out through a combination of a newly proposed setup for on-chip testing and finite element analyses to properly interpret the collected data. The experiments have aimed to provide a static loading to a stopper, exploiting electrostatic actuation to move a massive shuttle against it, up to failure. The failure mechanism observed in the tested devices has been captured by the numerical simulations. The data have been then interpreted by the Weibull theory for three different stopper sizes, leading to an estimation of the reference out-of-plane strength of polysilicon on the order of 2.8–3.0 GPa, in line with other results available in the literature. Full article
(This article belongs to the Special Issue MEMS in Italy)
►▼ Show Figures

Figure 1

7 pages, 2125 KiB  
Proceeding Paper
On-Chip Tests for the Characterization of the Mechanical Strength of Polysilicon
by Tiago Vicentini Ferreira do Valle, Aldo Ghisi, Stefano Mariani, Gabriele Gattere, Francesco Rizzini, Luca Guerinoni and Luca Falorni
Eng. Proc. 2022, 27(1), 10; https://doi.org/10.3390/ecsa-9-13363 - 1 Nov 2022
Viewed by 1130
Abstract
Microelectromechanical systems (MEMS) are nowadays widespread in the sensor market, with several different applications. New production techniques and ever smaller device geometries require a continuous investigation of potential failure mechanisms in such devices. This work presents an experimental on-chip setup to assess the [...] Read more.
Microelectromechanical systems (MEMS) are nowadays widespread in the sensor market, with several different applications. New production techniques and ever smaller device geometries require a continuous investigation of potential failure mechanisms in such devices. This work presents an experimental on-chip setup to assess the geometry- and material-dependent strength of stoppers adopted to limit the deformation of movable parts, using an electrostatically actuated device. A series of comb-finger and parallel plate capacitors are used to provide a rather large stroke to a shuttle, connected to the anchors through flexible springs. Upon application of a varying voltage, failure of stoppers of variable size is observed and confirmed by post-mortem ΔC–V curves. The results of the experimental campaign are collected to infer the stochastic property of the strength of polycrystalline, columnar silicon films. Full article
(This article belongs to the Proceedings of The 9th International Electronic Conference on Sensors and Applications)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying article 1-50 on page 1 of 1.
Back to TopTop