Search Results (2)

Femtosecond laser material processing (FLMP) was used to make an X-ray mask in a 500 µm thick tungsten sheet without the use of any chemical etch methods. The laser produced an 800 nm wavelength at a 1 kHz repetition rate and a pulse width of 100 fs. The laser beam arrival at the tungsten sheet was synchronized to a computer numerically controlled (CNC) stage that allowed for motion in the XYZθ directions. The X-ray mask design was made using CAD/CAM software (Alphacam 2019 R1) and it consisted of linear, circular, and 45° angle features that covered an area of 10 mm × 10 mm. A total of 70 laser beam passes at a moderate laser energy of 605.94 J/cm² were used to make through-cut features into the tungsten sheet. The morphology of the top view (laser incident, LS) images showed cleaner and smoother cut edges relative to the bottom view (laser exit, LE) images. It was found that the size dimensions of the through-cut features on the LE surfaces were better aligned with the CAD dimensions than those of the LS surfaces. The focused laser beam produced inclined cut surfaces as the beam made the through cut from the LS to the LE of the tungsten sheet. The circular features at the LS surface deviated toward being oval-like on the LE surface, which could be compensated for in future CAD designs. The dependence of the CNC processing speed on the thickness of the etch depth was determined to have a third-order exponential decay relationship, thereby producing a theoretical model that will be useful for future investigators to predict the required experimental parameters needed to achieve a known etch depth in tungsten. This is the first study that has demonstrated the capability of using a femtosecond laser to machine through-cut an X-ray mask in a 500 µm thick tungsten sheet with no involvement of a wet etch or any other such supporting process. Full article

Micromodels are ideal candidates for microfluidic transport investigations, and they have been used for many applications, including oil recovery and carbon dioxide storage. Conventional fabrication methods (e.g., photolithography and chemical etching) are beset with many issues, such as multiple wet processing steps and isotropic etching profiles, making them unsuitable to fabricate complex, multi-depth features. Here, we report a simpler approach, femtosecond laser material processing (FLMP), to fabricate a 3D reservoir micromodel featuring 4 different depths—35, 70, 140, and 280 µm, over a large surface area (20 mm × 15 mm) in a borosilicate glass substrate. The dependence of etch depth on major processing parameters of FLMP, i.e., average laser fluence (${\mathrm{LF}}_{\mathrm{av}}$), and computer numerically controlled (CNC) processing speed (${\mathrm{PS}}_{\mathrm{CNC}}$), was studied. A linear etch depth dependence on ${\mathrm{LF}}_{\mathrm{av}}$ was determined while a three-phase exponential decay dependence was obtained for ${\mathrm{PS}}_{\mathrm{CNC}}$. The accuracy of the method was investigated by using the etch depth dependence on ${\mathrm{PS}}_{\mathrm{CNC}}$ relation as a model to predict input parameters required to machine the micromodel. This study shows the capability and robustness of FLMP to machine 3D multi-depth features that will be essential for the development, control, and fabrication of complex microfluidic geometries. Full article